External storage device

ABSTRACT

Described are external storage devices including a substrate, a controller electrically coupled to the substrate, at least one memory die stack electrically coupled to the substrate, a plurality of connection fingers electrically coupled to the substrate, and a mounting bar electrically coupled to the substrate. The mounting bar may include a plurality of springs. In other examples, the external storage device may include a substrate, a controller electrically coupled to the substrate, at least one memory die stack electrically coupled to the substrate, a plurality of connection fingers electrically coupled to the substrate, and a contact bar electrically coupled to the substrate. The contact bar may include a plurality of extensions. One or more memory die stacks may be coupled to one or more surfaces of the substrate and may include a plurality of dies in each memory die stack.

CROSS REFERENCE TO RELATED APPLICATION

This application is related to and claims priority benefits from U.S.Provisional Application Ser. No. 61/438,139, filed on Jan. 31, 2011,entitled USB 3 COB STICK, and from U.S. Provisional Application Ser. No.61/442,379, filed on Feb. 14, 2011, entitled USB 3 COB STICK BACKCONTACT. The '139 and '379 applications are hereby incorporated hereinin their entirety by this reference.

FIELD OF THE INVENTION

The invention relates to mobile storage devices and the like.

BACKGROUND

Universal serial bus (“USB”) sticks consist of a memory data storagedevice integrated with a USB interface. USB sticks are typically usedfor similar purposes for which floppy disks or CD-ROMs were previouslyused. However, USB sticks are smaller, faster, have thousands of timesmore capacity, and are more durable and reliable. In the case of USBsticks with chip on board (“COB”) flash memory, a USB controller andflash memory can be combined into one structure that is embedded intoone side of a printed circuit board (“PCB”) with the USB connectionlocated on an opposing surface.

The USB standard that governs the design of the USB connections hasundergone several revisions since its earliest release in 1994. Thefirst widely adopted version, USB 1.1, specified data rates of 1.5Mbit/s (“Low-Bandwidth”) and 12 Mbit/s (“Full-Bandwidth”). USB 1.1 wasreplaced by USB 2.0 in 2000. USB 2.0 provided a higher maximum data rateof 480 Mbit/s (“Hi-Speed”). In this version, the USB 2.0 cable has fourwires: two wires for power (+5 volts and ground) and a twisted pair ofwires for carrying data. In the USB 2.0 design, as well as USB 1.1, datais transmitted in one direction at a time (downstream or upstream).

In 2008, a new USB 3.0 standard was announced. USB 3.0 includes a new“SuperSpeed” bus, which provides a fourth data transfer mode at 5.0Gbit/s. In order to achieve this increased throughput, the USB 3.0 cablehas a total of eight wires: two wires for power (+5 volts and ground),the twisted pair for carrying non-SuperSpeed data (allows backwardcompatibility with earlier versions of USB devices), and twodifferential pairs for carrying SuperSpeed data. Full-duplex signalingoccurs over the two differential pairs.

To date, adoption of the USB 3.0 standard has been slow due to the needto re-design motherboard hardware that supports the USB 3.0 standard,and the need to revise operating systems to support the USB 3.0standard. To ease the transition to the USB 3.0 standard, it isdesirable to modify existing USB 2.0 COB sticks to also include USB 3.0connections.

Because the USB 2.0 COB stick configuration has a rectilinear designwith the components embedded on one side of the PCB and the USB 2.0connections positioned flush with the opposing side of the PCB, theshape and configuration does not readily allow the addition of a USB 3.0connection to the existing USB 2.0 COB stick. With USB 3.0 being thecoming standard and much faster than USB 2.0, it is desirable to providea design that incorporates USB 3.0 connections into existing USB 2.0 COBsticks so that the USB COB stick may connect to either version of theUSB standard.

SUMMARY

Embodiments of the invention may comprise an external storage devicehaving a substrate, a controller electrically coupled to the substrate,at least one memory die stack electrically coupled to the substrate, aplurality of connection fingers electrically coupled to the substrate,and a mounting bar electrically coupled to the substrate. The externalstorage device may be configured to support at least two USB standardswith interfaces that are mechanically different. The mounting bar may bemounted to a component surface of the substrate and may be substantiallyenclosed by an outer casing that surrounds the substrate. In theseembodiments, the external storage device may comprise substantially flatsurfaces on all sides. The mounting bar may also comprises a pluralityof springs. In some embodiments, the plurality of springs may include acoupling projection positioned proximate an end of each spring. Thecoupling projections may be configured to extend through a plurality ofapertures in the component surface in an uncompressed position.

In other embodiments, the external storage device may comprise thesubstrate, the controller electrically coupled to the substrate, thememory die stack electrically coupled to the substrate, the plurality ofconnection fingers electrically coupled to the substrate, and a contactbar electrically coupled to the substrate. The external storage devicemay be configured to support at least two USB standards with interfacesthat are mechanically different. The contact bar may be mounted to aconnection surface of the substrate and may also include a cover. Inthese embodiments, the contact bar comprises a plurality of extensions.In some embodiments, the plurality of extensions may include a couplingprojection positioned proximate an end of each extension. The couplingprojections may be configured to extend through a plurality of aperturesin the cover in an uncompressed position.

The memory die stack may be mounted to the component surface or aconnection surface of the substrate. In some embodiments, the externalstorage device further comprises a plurality of memory die stacks. Inthese embodiments, at least one of the memory die stacks is attached toa connection surface of the substrate, and at least one of the memorydie stacks is attached to a component surface of the substrate. Thememory die stacks may each comprise a plurality of dies. In someembodiments, at least two of the memory die stacks are stacked in anoverlapping arrangement.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a front perspective view of an external storage deviceaccording to certain embodiments of the present invention.

FIG. 2 is a front perspective view of the external storage device ofFIG. 1 with coupling points.

FIG. 3 is a perspective view of a contact bar for use with the externalstorage device of FIG. 2.

FIG. 4 is a board of the contact bar of FIG. 3.

FIG. 5 is a cover of the contact bar of FIG. 3.

FIG. 6 is a bottom view of the contact bar of FIG. 3.

FIG. 7 is a front perspective view of the board of FIG. 4 in use withthe external storage device of FIG. 2.

FIG. 8 is a front perspective view of the contact bar of FIG. 3 in usewith the external storage device of FIG. 2.

FIG. 9 is a front perspective view of the board of FIG. 4 in use with anexternal storage device according to other embodiments of the presentinvention.

FIG. 10 is a front perspective view of the board of FIG. 4 in use withan external storage device according to other embodiments of the presentinvention.

FIG. 11 is a back perspective view of the external storage device ofFIG. 2.

FIG. 12 is a front perspective view of an external storage deviceaccording to other embodiments of the present invention.

FIG. 13 is a back perspective view of the external storage device ofFIG. 12.

FIG. 14 is a perspective view of a spring of the mounting bar of theexternal storage device of FIG. 12.

FIG. 15 is a perspective view of the mounting bar of the externalstorage device of FIG. 12.

FIG. 16 is a side view of the external storage device of FIG. 2 with asingle memory die stack positioned on a component surface of asubstrate, the memory die stack having a single die.

FIG. 17 is a side view of the external storage device of FIG. 12 with asingle memory die stack positioned on a component surface of asubstrate, the memory die stack having a single die.

FIG. 18 is a side view of the external storage device of FIG. 2 with twomemory die stacks positioned on two surfaces of a substrate, each memorydie stack having a single die.

FIG. 19 is a side view of the external storage device of FIG. 12 withtwo memory die stacks positioned on two surfaces of a substrate, eachmemory die stack having a single die.

FIG. 20 is a side view of the external storage device of FIG. 2 with asingle memory die stack positioned on a component surface of asubstrate, the memory die stack having two dies.

FIG. 21 is a side view of the external storage device of FIG. 12 with asingle memory die stack positioned on a component surface of asubstrate, the memory die stack having two dies.

FIG. 22 is a side view of the external storage device of FIG. 2 withfour memory die stacks positioned on two surfaces of a substrate, eachmemory die stack having a single die.

FIG. 23 is a side view of the external storage device of FIG. 12 withfour memory die stacks positioned on two surfaces of a substrate, eachmemory die stack having a single die.

FIG. 24 is a side view of the external storage device of FIG. 2 with twomemory die stacks positioned on two surfaces of a substrate, each memorydie stack having two dies.

FIG. 25 is a side view of the external storage device of FIG. 12 withtwo memory die stacks positioned on two surfaces of a substrate, eachmemory die stack having two dies.

FIG. 26 is a side view of the external storage device of FIG. 2 with twomemory die stacks positioned on a component surface of a substrate, eachmemory die stack having two dies.

FIG. 27 is a side view of the external storage device of FIG. 12 withtwo memory die stacks positioned on a component surface of a substrate,each memory die stack having two dies.

FIG. 28 is a side view of the external storage device of FIG. 2 with twomemory die stacks positioned on a connection surface of a substrate,each memory die stack having two dies.

FIG. 29 is a side view of the external storage device of FIG. 2 withfour memory die stacks positioned on two surfaces of a substrate, eachmemory die stack having two dies.

FIG. 30 is a side view of the external storage device of FIG. 12 withfour memory die stacks positioned on two surfaces of a substrate, eachmemory die stack having two dies.

FIG. 31 is a side view of the external storage device of FIG. 2 with twomemory die stacks positioned on a component surface of a substrate, eachmemory die stack having four dies.

FIG. 32 is a side view of the external storage device of FIG. 12 withtwo memory die stacks positioned on a component surface of a substrate,each memory die stack having four dies.

FIG. 33 is a side view of the memory die stack of the external storagedevice of FIG. 31 or 32, wherein the dies are arranged in a stair steppattern.

FIG. 34 is a side view of the memory die stack of the external storagedevice of FIG. 31 or 32, wherein the dies are arranged in an alternatingpattern.

FIG. 35 is a side perspective view of an external storage deviceaccording to other embodiments of the present invention.

DETAILED DESCRIPTION

The described embodiments of the invention provide external storagedevices for use with multiple interface connection standards. While thedesigns are discussed for use with external storage devices, they are byno means so limited. Rather, embodiments of these designs may be usedfor other devices that couple to any type of serial bus connection,parallel bus connection, or otherwise as desired.

FIGS. 1-34 illustrate embodiments of an external storage device 10. Inthe embodiments shown in FIGS. 8-13, the device 10 comprises a substrate12, a connector 14, a controller 16, and at least one memory die stack18.

As best shown in FIGS. 11 and 13, the substrate 12 may be a printedcircuit board (“PCB”), which is used to mechanically support andelectrically connect the other components of the device 10. In someembodiments, the substrate 12 can include a component surface 24 and aconnection surface 26. Items such as an oscillator, an LED status light,discrete components, or other suitable devices, may be mounted andelectrically coupled to the component surface 24 and/or the connectionsurface 26.

In some embodiments, as illustrated in FIGS. 1-2, 7-10, and 12, theconnector 14 may be positioned proximate an end 46 of the substrate 12and configured to be inserted within a corresponding connector. Incertain embodiments, the connector 14 may be configured to couple to acorresponding USB 2.0 connector, USB 3.0 connector, or any otherstandard that is forward or backwards compatible with any of theforegoing USB standards, other suitable serial bus connection, parallelbus connection, or otherwise as desired. However, one of ordinary skillin the relevant art will understand that the connection standards may beany suitable connection standards that achieve the desired performanceof the device 10.

In some embodiments, such as the embodiments illustrated in FIGS. 8-10,the connector 14 may comprise a plurality of connection fingers 20 and acontact bar 22. In these embodiments, the connection fingers 20 may bemounted to or embedded within the connection surface 26 of the substrate12 and electrically coupled to the substrate 12. In certain embodiments,such as where the corresponding connector is a USB 2.0 connector or anyother standard that is forward or backwards compatible with the USB 2.0standard, the connection fingers 20 may be configured to electricallycouple to the power and ground wires and the twisted pair of wires (forHi-Speed and lower data transfer) of the corresponding USB 2.0 connectorwhen the connector 14 is inserted within the corresponding USB 2.0connector. In the embodiments shown in FIGS. 1-2, 7-10, and 12, theconnector 14 may comprise four connection fingers 20. However, one ofordinary skill in the relevant art will understand that any suitablenumber and configuration of connection fingers 20 may be used inconjunction with the USB 2.0 standard or other suitable standards.

In some embodiments, such as the embodiments shown in FIGS. 8-10, thecontact bar 22 may be mounted to the connection surface 26 andelectrically coupled to the substrate 12 via a plurality of couplingpoints 28. In these embodiments, as shown in FIG. 2, the substrate 12comprises five coupling points 28. However, one of ordinary skill in therelevant art will understand that any suitable number and configurationof coupling points 28 may be used. In other embodiments, the couplingpoints 28 are configured to electrically couple to other types ofadditional components. In these embodiments, the contact bar 22 forms aprojection on the otherwise substantially flat connection surface 26.

In some embodiments, as best illustrated in FIGS. 3-6, the contact bar22 comprises a board 30 and a cover 32. In these embodiments, as shownin FIG. 4, the board 30 may be a PCB, where an end 34 of the board 30can include a plurality of connection pads 36. In some embodiments, theboard 30 may comprise five connection pads 36, as shown in FIGS. 4 and6-7. However, one of ordinary skill in the relevant art will understandthat any suitable number and configuration of connection pads 36 may beused in conjunction with the USB 3.0 standard or other suitablestandards.

The connection pads 36 may be positioned on the board 30 so as tosubstantially align with the position of the coupling points 28 when thecontact bar 22 is mounted to the connection surface 26, as illustratedin FIG. 7. The connection pads 36 may be soldered or otherwiseelectrically coupled to the coupling points 28 in a suitable manner thatallows each connection pad 36 to be electrically connected to thecorresponding coupling point 28.

In some embodiments, as shown in FIG. 2, the coupling points 28 may bemounted to or embedded within the connection surface 26 of the substrate12 and electrically coupled to the substrate 12. In these embodiments,the coupling points 28 may be positioned adjacent and/or behind theconnection fingers 20. In other embodiments, the coupling points 28 maybe mounted to or embedded within the component surface 24, while theconnection fingers 20 may be mounted to or embedded within theconnection surface 26, or vice versa. One of ordinary skill in therelevant art will understand that the coupling points 28 may bepositioned in any suitable location on the substrate 12 that allows thecontact bar 22 to electrically couple to the substrate 12.

The board 30 can include a plurality of extensions 38, as best shown inFIGS. 4 and 6-7. In some embodiments, each extension 38 may also be aPCB having some resilient attributes that cause the extension 38, whenbent, to exert a force to return to its original position. One ofordinary skill in the relevant art will understand that the extensions38 may be made of any suitable material and have any suitable designthat allows the contact bar 22 to electrically couple to thecorresponding connector when the connector 14 is inserted within thecorresponding connector.

In these embodiments, as shown in FIG. 4, each extension 38 can includea coupling projection 40 positioned proximate an end 42 of eachextension 38. The coupling projection 40 may be soldered or otherwiseelectrically coupled to the extension 38 in a suitable manner thatallows the coupling projection 40 to be electrically coupled to thecorresponding connection pad 36. The coupling projection 40 may have anysuitable shape that provides sufficient contact with the correspondingconnector when the connector 14 is inserted within the correspondingconnector. Examples of suitable shapes include but are not limited to atriangular, L-shape, U-shape, T-shape, solid projection having acircular or rectilinear cross-sectional shape, or other suitable shapes.

In some embodiments, such as the embodiments illustrated in FIG. 3, thecover 32 may be positioned over the board 30. The cover 32 may be formedof materials including but not limited to any high thermal-resistantplastics, polymers, or other suitable materials. As shown in FIGS. 3 and5, the cover 32 may also include a plurality of apertures 44 positionedover the plurality of extensions 38 and proximate the end 42 of eachextension 38. The apertures 44 are configured to allow the couplingprojections 40 to extend through the apertures 44 when the extensions 38are in an uncompressed position.

In some embodiments, the connector 14 may be positioned proximate theend 46 of the substrate 12 so that the connection fingers 20 (wheninserted within the corresponding USB 2.0 connector or any otherstandard that is forward or backwards compatible with the USB 2.0standard) or the connection fingers 20 and coupling projections 40 (wheninserted within the corresponding USB 3.0 connector or any otherstandard that is forward or backwards compatible with the USB 3.0standard) electrically couple to the corresponding USB connector. Whenthe connector 14 is inserted within the corresponding USB 3.0 connector(not shown), the USB 3.0 connector presses against the couplingprojections 40, in turn applying a bending force to the extensions 38.When the extensions 38 are bent by the USB 3.0 connector, thespring-loaded design of each extension 38 then applies a force to theUSB 3.0 connector and the coupling projection 40 to ensure that thecomponents are securely and electrically coupled. In some embodiments,as shown in FIG. 6, a ball 48 may be positioned on the end 42 of eachextension 38 opposite the coupling projection 40. The ball 48 may beformed of materials including but not limited to silicone, normalrubber, latex, or other suitable materials. Moreover, the ball 48 may bea metal spring or a micro spring. One of ordinary skill in the relevantart will understand that the ball 48 may have any suitable constructionor form that provides elastic properties to the extension 38. The ball48 provides additional force to create a firm electrical couplingbetween the corresponding USB 3.0 connector and each coupling projection40 when the connector 14 is inserted within the corresponding USB 3.0connector because the ball 48 is at least partially compressed when theconnector 14 is inserted within the corresponding USB 3.0 connector.

In other embodiments, such as the embodiments shown in FIG. 12, theconnector 14 may comprise the plurality of connection fingers 20discussed above, along with a mounting bar 50. As best illustrated inFIG. 13, the mounting bar 50 is positioned on the component surface 24so that the connection surface 26 may remain substantially flat ifdesirable. In these embodiments, as best shown in FIGS. 13-15, themounting bar 50 may comprise a plurality of contact springs 52. Eachspring 52 may be formed of a resilient material that, when bent orcompressed, exerts a force to return to its original shape. One ofordinary skill in the relevant art will understand that the springs 52may be made of any suitable material and have any suitable design thatallows the mounting bar 50 to electrically couple to the correspondingconnector when the connector 14 is inserted within the correspondingconnector.

As shown in FIG. 15, the mounting bar 50 may also include a plurality ofreceptacles 54 that are shaped to receive the contact springs 52. Asillustrated in FIG. 14, each spring 52 may include a hook 56 that mountsand electrically couples the spring 52 to an edge 58 of the mounting bar50, which is best shown in FIG. 15. In some embodiments, such as theembodiments shown in FIG. 14, the hook 56 may have a U-shape thatsubstantially conforms to the shape of the edge 58. In other embodimentsthe hook 56 may be substantially straight and configured to be insertedwithin a corresponding aperture on the edge 58. One of ordinary skill inthe relevant art will understand that any suitable coupling arrangementmay be used between the hook 56 and the edge 58.

Each spring 52 may also include a coupling projection 60, as bestillustrated in FIGS. 14-15. In some embodiments, the coupling projection60 may be integrally formed with the spring 52. In other embodiments,the coupling projection 60 may be soldered or otherwise electricallycoupled to the spring 52 in a suitable manner that allows the couplingprojection 60 to be electrically coupled to the substrate 12. Thecoupling projection 60 may have any suitable shape that providessufficient contact with the corresponding connector when the connector14 is inserted within the corresponding connector. Examples of suitableshapes include but are not limited to a triangular, L-shape, U-shape,T-shape, solid projection having a circular or rectilinearcross-sectional shape, or other suitable shapes.

In these embodiments, the mounting bar 50 may be mounted to andelectrically coupled directly to the substrate 12. By incorporating themounting bar 50 within the internal assembly of the device 10, themounting bar 50 is electrically coupled directly to the substrate 12without the need to solder the mounting bar 50 to a plurality ofcoupling points 28. However, one of ordinary skill in the relevant artwill understand that any suitable configuration of the mounting bar 50and/or springs 52 may be used in conjunction with the USB 3.0 standardor other suitable standards. As illustrated in FIGS. 17, 19, 21, 23, 25,27, 30, and 32, one of ordinary skill in the relevant art willunderstand that the mounting bar 50 may be positioned in any suitableorientation relative to the substrate 12.

The mounting bar 50 may then electrically couple the substrate 12 to thecorresponding connector via the coupling projections 60. In theseembodiments, a plurality of apertures 62 are positioned in the componentsurface 24 adjacent the plurality of connection fingers 20. The couplingprojections 60 are configured to extend through the apertures 62 whenthe springs 52 are in an uncompressed position.

When the connector 14 is inserted within the corresponding USB 3.0connector (not shown), the USB 3.0 connector presses against thecoupling projections 60, in turn applying a compressive force to thesprings 52. When the springs 52 are compressed by the USB 3.0 connector,the spring-loaded design of each spring 52 then applies a force tocreate a firm electrical coupling between the USB 3.0 connector and eachcoupling projection 60 when the connector 14 is inserted within thecorresponding USB 3.0 connector.

In the various embodiments described herein, an outer casing 66 may beapplied to enclose the assembled substrate 12 and components. In someembodiments, a sealant may be applied to the mounting bar 50 to preventthe case material from flowing into the mounting bar 50 and the internalassembly of the device 10 during the assembly process. Specifically,glue or epoxy may be used to ensure a tight connection and avoid havingthe case material introduced into the space below the contact bar 22.

In the embodiments where the mounting bar 50 is mounted on the componentsurface 24, the mounting bar 50 does not form a projection on theotherwise substantially flat connection surface 26. In some embodiments,the thickness of the mounting bar 50 may not exceed the thicknesses ofthe other components positioned on the component surface 24, thusallowing at least the mounting bar 50 portion of the connector 14 to beincorporated into the existing dimensions of the device 10. Moreover,the retractable design of the contact springs 52 may allow the couplingprojections 60 to completely retract within the outer casing 66 when thedevice 10 is inserted within a corresponding USB 2.0 connector.

Furthermore, by incorporating the mounting bar 50 within the outercasing 66, the manufacturing throughput is improved because the device10 is assembled as one single part, which is easy to handle by pick andplace assembly machines.

In other embodiments, such as the embodiments shown in FIG. 35, theconnector 14 may comprise a combination of the contact bar 22 and thesprings 52 discussed above. In these embodiments, the connection fingers20 may be mounted to or embedded within the cover 32 of the contact bar22 and electrically coupled to the substrate 12. The cover 32 may alsoinclude the plurality of apertures 44 positioned adjacent and/or behindthe connection fingers 20. Each spring 52 may be mounted to the contactbar 22 so that the coupling projection 60 extends through each aperture44 when the springs 52 are in an uncompressed position. Each spring 52may also include the connection pad 36, which may be integrally formedwith the spring 52, soldered or otherwise electrically coupled to thespring 52 in a suitable matter that allows the coupling projection 60 toelectrically couple to the substrate 12.

In these embodiments, such as the embodiments illustrated in FIGS.16-32, the memory die stack 18 may include at least one die 64. Forexample, in FIGS. 16-19 and 22-23, each memory die stack 18 can includea single die 64. The memory die stacks 18 shown in FIGS. 20-21 and 24-30can include two dies 64 in each memory die stack 18. Each memory diestack 18 shown in FIGS. 31-34 may include four dies 64 within eachmemory die stack 18. One of ordinary skill in the relevant art willunderstand that the memory die stack 18 may include 1, 2, 4, or anysuitable number of dies 64. Each die 64 may include connectors 68 thatconnect the die 64 to a memory channel 70, which in turn connects thedie 64 to the controller 16. In some embodiments, the design may includea pair of memory channels 70, also known as dual channel processing,wherein each die 64 (in a memory die stack 18 having two dies 64) isconnected to each memory channel 70. With a dual channel configuration,the controller 16 may access each die 64 together or separately. As aresult, transactions may be executed twice as fast with dual channelprocessing.

In the memory die stacks 18 that include more than one die 64, the dies64 may be arranged within the memory die stack 18 in a variety ofstacking patterns. For example, as shown in FIGS. 33-34, the dies 64 maybe arranged in a stair step pattern (FIG. 33), an alternating pattern(FIG. 34), a straight stack, or other suitable stacking arrangements.Any suitable arrangement of dies 64 may be used that allow theconnectors 68 from each die 64 to reach the memory channel 70. In someembodiments, such as the embodiments shown in FIGS. 20-21, 24-30, and34, each die 64 may be rotated 180 degrees from each adjacent die 64. Bystacking the dies 64 in a rotated orientation, the heat distribution isimproved because the heat generating components (such as the connectors68) are not adjacent one another.

In some embodiments, such as the embodiments shown in FIGS. 16-17 and20-21, a single memory die stack 18 may be mounted to and electricallycoupled to the substrate 12. In other embodiments, such as theembodiments shown in FIGS. 18-19, 24-28, and 31-32, the device 10 maycomprise two memory die stacks 18. In yet other embodiments, such as theembodiments shown in FIGS. 22-23 and 29-30, the device 10 may comprisefour memory die stacks 18. In some embodiments, the memory die stacks 18may be arranged opposite one another so that the memory die stacks 18are equally distributed on the component surface 24 and an opposingcomponent surface 24A (FIGS. 18-19, 22-25, 29-30), may be positioned onthe component surface 24 only (FIGS. 16-17, 20-21, 26-27, and 31-32), ormay be positioned on the opposing component surface 24A only (FIG. 28).However, one of ordinary skill in the relevant art will understand thatany suitable location and distribution of memory die stacks 18 on thecomponent surface 24 and the opposing component surface 24A may beutilized to achieve the desired performance of the device 10.

The inclusion of the additional memory die stacks 18 provides additionaldata speed for the device 10. In the embodiments shown in FIGS. 24-28,which include two memory die stacks 18 in a dual channel configuration(with each memory die stack 18 having two dies 64), the use of twomemory die stacks 18 increases the design from a two-channel to afour-channel operation, which approximately doubles the data speed. Inother embodiments shown in FIGS. 29-30, which include four memory diestacks 18 in a dual channel configuration (each memory die stack 18having two dies 64), the design has an eight-channel operation, whichapproximate quadruples the data speed.

Alternatively, as shown in FIGS. 31-32, an eight-channel operation maybe achieved through the use of two memory die stacks 18 (with eachmemory die stack 18 having four dies 64) and a separate memory channel70 for each die 64. In these embodiments, in order to minimize theheight of the connectors 68, the connectors 68 between each die 64 tothe memory channel 70 may pass through the other dies 64 located betweenthe die 64 and the memory channel 70.

In the embodiments where two memory die stacks 18 are positionedadjacent one another (either on the component surface 24 or the opposingcomponent surface 24A), the dies 64 in each memory die stack 18 can bestacked onto each other in an overlapping arrangement to conserve spaceon the substrate 12.

One of ordinary skill in the art will understand that any suitablenumber and configurations of dies 64 and memory die stacks 18 may beused to achieve the desired data speed and compact design of the device10.

The foregoing is provided for purposes of illustrating, explaining, anddescribing embodiments of the present invention. Further modificationsand adaptations to these embodiments will be apparent to those skilledin the art and may be made without departing from the scope or spirit ofthe invention.

That which is claimed is:
 1. An external storage device comprising: asubstrate that includes a connection surface and a component surface,the connection surface opposite the component surface; at least onememory die stack mounted on one of the connection surface and thecomponent surface of; a controller configured to access the at least onememory die stack, the controller mounted on one of the connectionsurface and the component surface of the substrate; a contact barmounted on the connection surface of the substrate, the contact barcomprising a cover and a plurality of springs, each of the plurality ofsprings including a portion that is located at a first distance relativeto the connection surface of the substrate; a plurality of connectionfingers embedded to be exposed upon the cover of the contact bar,wherein the plurality of connection fingers are located at a seconddistance relative to the connection surface of the substrate, the seconddistance being less than the first distance; and wherein a firstinterface comprises the plurality of connection fingers, and a secondinterface comprises the plurality of springs.
 2. The external storagedevice of claim 1, wherein each of the plurality of springs furthercomprises a projection configured to be located at the first distance inan uncompressed position.
 3. The external storage device of claim 2,wherein the projections are configured to extend through a plurality ofapertures in the cover in the uncompressed position.
 4. The externalstorage device claim 1, wherein the at least one memory die stack ismounted on the component surface of the substrate.
 5. The externalstorage device of claim 1, wherein the at least one memory die stack ismounted on the connection surface of the substrate.
 6. The externalstorage device of claim 1, further comprising a plurality of memory diestacks, wherein at least one of the plurality of memory die stacks ismounted on the connection surface of the substrate, and at least one ofthe plurality of memory die stacks is mounted on the component surfaceof the substrate.
 7. The external storage device of claim 6, whereineach of the plurality of memory die stacks comprises a plurality ofdies.
 8. The external storage device of claim 7, wherein the pluralityof dies of at least two of the plurality of memory die stacks arestacked in an overlapping arrangement.
 9. The external storage device ofclaim 1, wherein the first distance comprises a first height above theconnection surface, and the second distance comprises a second heightabove the connection surface, wherein the second height is less than thefirst height.
 10. The external storage device of claim 1, wherein eachof the springs includes a connection pad.
 11. The external storagedevice of claim 10, wherein each of the springs is integrally formedwith the corresponding connection pad.
 12. A external storage devicecomprising: a substrate that includes a connection surface and acomponent surface, the connection surface opposite the componentsurface; at least one memory die stack mounted on one of the connectionsurface and the component surface of the substrate; a controllerconfigured to access the at least one memory die stack, the controllermounted on one of the connection surface and the component surface ofthe substrate; a contact bar mounted on the connection surface of thesubstrate, the contact bar comprising a cover and a plurality ofsprings, each of the plurality of springs including a portion that islocated at a first distance relative to the connection surface of thesubstrate; a plurality of connection fingers embedded to be exposed uponthe cover of the contact bar, wherein the plurality of connectionfingers are located at a second distance relative to the connectionsurface of the substrate, the second distance being less than the firstdistance; and a plurality of coupling points mounted on the connectionsurface of the substrate for electrically coupling with the contact bar;wherein a first interface comprises the plurality of connection fingers,and a second interface comprises the plurality of springs.
 13. Theexternal storage device of claim 12, wherein the at least one memory diestack is mounted on the component surface of the substrate.
 14. Theexternal storage device of claim 12, wherein the at least one memory diestack is mounted on the connection surface of the substrate.
 15. Theexternal storage device of claim 12, further comprising a plurality ofmemory die stacks, wherein at least one of the plurality of memory diestacks is mounted on the connection surface of the substrate, and atleast one of the plurality of memory die stacks is mounted on thecomponent surface of the substrate.
 16. The external storage device ofclaim 15, wherein each of the plurality of memory die stacks comprises aplurality of dies.
 17. The external storage device of claim 16, whereinthe plurality of dies of at least two of the plurality of memory diestacks are stacked in an overlapping arrangement.
 18. An externalstorage device comprising: a substrate that includes a connectionsurface and a component surface, the connection surface opposite thecomponent surface; at least one memory die stack mounted on one of theconnection surface and the component surface of; a controller configuredto access the at least one memory die stack, the controller mounted onone of the connection surface and the component surface of thesubstrate; a contact bar mounted on the connection surface of thesubstrate, the contact bar comprising a cover and a plurality ofsprings, each of the plurality of springs including a portion that islocated at a first distance relative to the connection surface of thesubstrate; a plurality of connection fingers embedded to be exposed uponthe cover of the contact bar, wherein the plurality of connectionfingers are located at a second distance relative to the connectionsurface of the substrate, the second distance being less than the firstdistance; and wherein a first interface comprises the plurality ofconnection fingers, and a second interface comprises the plurality ofsprings; and wherein the external storage device is configured tosupport Universal Serial Bus “USB”) 2.0 and USB 3.0 standards in effectas of Jan. 31, 2011.